System for real-time control of semiconductor wafer polishing in

Details System for real-time control of semiconductor wafer polishing in System for real-time control of semiconductor wafer polishing in

1995-10-24

1997-07-01

Smith, James G.

Abrading

Machine

Rotary tool

451 7, B24B 500

Patent

active

056430604

ABSTRACT:
A system for polishing a semiconductor wafer, the system comprising a platen subassembly defining a polishing area; a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and means for heating the wafer while the wafer face is being polished.

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