System for rapidly and uniformly cooling resist

Details System for rapidly and uniformly cooling resist System for rapidly and uniformly cooling resist

2005-05-10

2005-05-10

Ciric, Ljiljana (Department: 3753)

Heat exchange

With timer, programmer, time delay, or condition responsive...

Having heating and cooling capability

C361S310000, C165S048100

Reexamination Certificate

active

06889763

ABSTRACT:
Resist coated wafers are rapidly and uniformly cooled by a fluid that has been cooled through the Joule-Thompson effect. Fluid from a high pressure reservoir is vented into a chamber that contains the substrates. By varying the pressure difference between the reservoir and the chamber, the temperature of the cooling fluid entering the chamber can be controlled. By also controlling the flow rate through the chamber, the average temperature difference between the fluid in the chamber and the substrates may be limited, whereby more uniform cooling is obtained. While the chamber pressure is lower than that in the high pressure reservoir, the chamber pressure may still be substantially greater than atmospheric. An elevated chamber pressure raises the specific heat and residence time of the fluid in the chamber, which also promotes uniform cooling.

REFERENCES:
patent: 3602714 (1971-08-01), Farmer et al.
patent: 4280807 (1981-07-01), Smith, Jr. et al.
patent: 4621279 (1986-11-01), Maier et al.
patent: 4652229 (1987-03-01), Mehnert et al.
patent: 5003783 (1991-04-01), Reale
patent: 5119637 (1992-06-01), Bard et al.
patent: 5281217 (1994-01-01), Edwards et al.
patent: 5709262 (1998-01-01), Sikes

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