Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2005-11-08
2005-11-08
Edmondson, Lynne R. (Department: 1725)
Metal fusion bonding
Process
Plural joints
C382S124000
Reexamination Certificate
active
06962282
ABSTRACT:
System for providing an open-cavity semiconductor package. The system includes a method for wire bonding a finger sensor die to an external circuit. The finger sensor die includes a sensor array having one or more die contacts that are wire bonded to one or more external contacts of the external circuit so that a usable portion of the sensor array is maximized. The method comprises steps of forming a ball at a first end of a bonding wire, forming an electrically conductive connection between the ball and a selected external contact of the external circuit, extending the bonding wire to a selected die contact so as to form a wire loop having a low loop height, and forming an electrically conductive stitch connection between a second end of the bonding wire and the selected die contact.
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Edmondson Lynne R.
Sheppard Mullin Richter & Hampton LLP
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