Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1999-03-12
2000-12-26
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
H01R 1200, H05K 100
Patent
active
061649791
ABSTRACT:
A high density electrical interconnect is achieved by incorporating a flexible circuit (140) that is removably connected to a low insertion force, ball grid array connector (100). The flexible circuit has a plurality of conductive runners (142), and each of the runners has a termination (144). The terminations are arranged in an array on the end of the flexible circuit. The low insertion force connector consists of a substrate (120) that has a pattern of pads (122) corresponding to the array on one side. The other side of the substrate has a corresponding array (124) that is electrically connected to the pads by conductive vias. An alignment feature (470) aligns the array on the flexible circuit to the pattern of pads on the substrate. Contact between the flexible circuit and the substrate is maintained by a compression means (150) that provides sufficient compressive force (310) to establish electrical connection between the array and the pads. The flexible circuit is removably connected to the low insertion force connector by insertion through the z-axis (149) of the substrate.
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Gillette Joseph G.
Mulligan Robert J.
Potter Scott G.
Abrams Neil
Dorinski Dale W.
Motorola Inc.
Zarroli Michael C.
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