Optics: measuring and testing – By alignment in lateral direction
Reexamination Certificate
2005-01-18
2005-01-18
Nguyen, Tu T. (Department: 2877)
Optics: measuring and testing
By alignment in lateral direction
Reexamination Certificate
active
06844933
ABSTRACT:
A system is provided for processing a semiconductor wafer. The wafer is pre-aligned at a first workstation. The pre-alignment may be accomplished by an edge sensor. Alignment mark portions of the wafer are exposed at the same workstation. A fiber optic bundle may be used to expose the alignment mark portions. A high degree of accuracy is not needed to expose the alignment mark portions. The accuracy achieved by the pre-alignment mechanism and the fiber optic bundle is sufficient. The invention saves processing time at a subsequent stepper or scanner exposure workstation.
REFERENCES:
patent: 4704027 (1987-11-01), Phillips
patent: 5424548 (1995-06-01), Puisto
patent: 5597590 (1997-01-01), Tanimoto et al.
patent: 5795687 (1998-08-01), Yasuda
patent: 5808731 (1998-09-01), Kirk
patent: 6038029 (2000-03-01), Finarov
patent: 6052173 (2000-04-01), Miura et al.
patent: 6245492 (2001-06-01), Huang et al.
patent: 6288773 (2001-09-01), Johnson et al.
Micro magazine.com; MICRO:Archive:Jan. 1997:Product Extra; 2 total pages.
Micro magazine.com; MICRO:Archive:Feb. 1997:World Beat; 2 total pages.
Micro magazine.com; MDL:MICRO:Nov/Dec 1997:IndNews:Order Desk; 2 total pages.
Micro magazine.com; MICRO:Jun. 1998: Industre News:300-mm Imperative; 2 total pages.
Micro magazine.com; MDL:MICRO:Nov/Dec 1997: IndNews:Expansions and . . . ; 2 total pages.
Ultra Stepper and ASM Lithography in Preliminary Discussion to Form Strategic Alliance; Ultratech Stepper Inc.; 2 total pages.
ASML; Product Line Overview; 2 total pages.
The Center for Precision Machining Inc.; “300mm Wafer chucks fir Semiconductor Industry” 1 page.
The Center for Precision Machining Inc.; Wafer handling chucks for the semiconductor . . . ; 2 total pages.
300mm Wafer Manufacturing Technology: More is Less in Semiconductor Production; 3 total pages.
Micro magazine.com; MICRO:Industry Nwes: Round the Circuit; (Jan. '99); 3 total pages.
Tom Cheyney; Micro magazine.com; MICRO:Archive:Jul. 1997:Facility Report; “Transferring technology to industrial par LETI's Grenoble Center”; 4 total pages.
“Study on Advanced Technology for Next Generation Devices”; 2 total pages.
DeJule; “Why Do We Care About CaF2?” Semiconductor Net5, Technology News, Jan 1999; 2 total pages.
Oakley; Special Situation, Omicron Technologies, Inc.; Conservative Speculator; 4 total pages.
Malinovich; “Process Control Enhances CMOS Sensors”; Photonics Online; 8 total pages.
Dickstein , Shapiro, Morin & Oshinsky, LLP
Micro)n Technology, Inc.
Nguyen Tu T.
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