Plastic article or earthenware shaping or treating: apparatus – Means applying electrical or wave energy directly to work – Electrical energy conducted through work
Patent
1995-03-01
1996-06-25
Heitbrink, Tim
Plastic article or earthenware shaping or treating: apparatus
Means applying electrical or wave energy directly to work
Electrical energy conducted through work
26427214, 26427217, 26432814, 264449, 425572, B29C 4572
Patent
active
055294740
ABSTRACT:
A system (30) and method for preheating molding compound in the form of resin pellets (20) used in molding integrated circuits (50). A slanted plate (36) is connected to an electrode (31) to preheat resin pellets (20). The slanted plate (36) produces a temperature gradient in pellets (20) with a high temperature end (21) and a lower temperature end (22). A preheated pellet (20) with the lower temperature end (22) first is placed in a mold pot (40). A transfer ram (46) contacts the high temperature end (21) of the pellet (20) to deform the pellet (20) and fill any void spaces between the pellet (20) and surrounding mold pot bushing (44). The ram (46) continues to deform the pellet (20) to force air or other gases from the mold pot bushing (44) and to inject molding compound into a mold cavity (42).
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Webster's Ninth New Collegiate Dictionary, p. 190 1986.
Alec Broers, "Choices for Tomorrow's Chips", New Scientist, pp. 23-27, Apr. 1992.
William C. Ward, "Volume Production of Unique Plastic Surface-Mount Modules for the IBM 80-ns 1Mbit DRAM Chip by Area Wire Bond Techniques" (IBM General Technology Division, Essex Junction, Vermont 05452, IEEE (569-5503/88/0000-0552), pp. 552-557.
Goh Jing S.
Lau Chee C.
Brady III Wade J.
Donaldson Richard L.
Hashim Paul C.
Heitbrink Tim
Texas Instruments Incorporated
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