System for positioning a semiconductor chip package with respect

Details System for positioning a semiconductor chip package with respect System for positioning a semiconductor chip package with respect

1990-12-19

1992-06-23

Nguyen, Vinh

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324 731, 324158R, 324158P, G01R 3102

Patent

active

051246449

ABSTRACT:
In a system for positioning a semiconductor chip package with respect to a testing surface, the distance between the package or the leads thereof and the testing surface is monitored while the package is pushed towards the testing surface. When the distance monitored falls below a certain value, the package is pushed further by a set distance. In this manner, good contact between the leads of the package and the contacts of the testing surface is achieved without destroying the coplanarity of the leads.

REFERENCES:
patent: 3896935 (1975-07-01), Hjelle et al.
patent: 4478352 (1984-10-01), Amundson et al.
patent: 4739175 (1988-04-01), Tamura
patent: 4758785 (1988-07-01), Rath
patent: 4818382 (1989-04-01), Anderson et al.
patent: 4839587 (1989-06-01), Flatley et al.
patent: 4862510 (1989-08-01), Duncan et al.
patent: 4996439 (1991-02-01), Linker

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