System for parallel processing of workpieces

Electricity: motive power systems – Positional servo systems – Program- or pattern-controlled systems

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C318S568110, C318S568150, C318S573000, C901S009000, C901S045000, C901S008000

Reexamination Certificate

active

06326755

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a system for transferring and sorting workpieces, and in particular to a transfer and sorting system including a robot having a dual paddle end effector capable of affecting parallel processing of workpieces.
2. Description of Related Art
The introduction of workpiece handling robots into the semiconductor fabrication process represented a significant advance in automation over manual and early transfer equipment for moving workpieces such as semiconductor wafers between various processing tools and/or workpiece storage locations. It is an important feature of conventional workpiece handling robots to be able to quickly and precisely acquire a workpiece from a first position, deliver it to a new location having different X, Y and Z coordinates in Cartesian space, and set it down without risk of damage to the workpiece.
In order to accomplish this, a typical robot includes a central mast mounted in a base for translation along a vertical axis. A proximal arm, or link, is rotatably mounted to an upper end of the mast, and a distal arm, or link, is rotationally mounted to the opposite end of the proximal link. The wafer handling robot further includes an end effector attached to the distal link for supporting the workpiece. The end effector is pivotally mounted to the distal link for synchronized motionwith the distal and proximal links. Various motors are further provided, conventionally mounted in the base, for translating the central mast, and for rotating the proximal and distal links such that the end effector may be controllably maneuvered in three-dimensional space.
In addition to their use in processing tools for forming the integrated circuits on the wafers, workpiece handling robots are used in stand alone processing tools such as for example wafer sorters. Wafer sorters are used for a variety of purposes in a fab, such as for example to transfer one or more wafers between various cassettes positioned on the wafer sorter. During this process, wafers from a number of cassettes can be combined into one cassette, and wafers from one cassette can alternatively be split up among a number of cassettes. The wafers can also be transferred between the cassettes in the same order or reordered as desired. Another function of a wafer sorter is to map the location of wafers within a cassette, and to detect incorrect positioning of wafers within a cassette.
A wafer sorter may further include an aligner. Conventional aligners have a chuck for supporting and rotating a wafer and typically two cameras, one for identifying a radial runout (i.e., a magnitude and direction by which the workpiece deviates from an expected centered position on the chuck), and for identifying the position of a notch located along the circumference of the wafer. An aligner typically includes a second camera for reading an optical character recognition (OCR) mark which identifies the workpiece. In a conventional wafer sorter, wafers are transferred one at a time to the chuck of the aligner which then rotates the wafer to determine the radial runout, identify the location of the notch, and to read the OCR mark. The wafers are then returned one at a time to the wafer cassette. Conventional aligner/robot systems which transfer workpieces one at a time between the workpiece cassette and aligner have a relatively low throughput, on the order of approximately 200-250 wafers per hour. This low throughput is significant as the alignment process must be performed for each processing station where an indicial mark reading is required, and must be performed on each individual wafer at each of these stations.
It is known to provide robots having two separate sets of robotic arms, or links, to increase throughput. One such multiple armed robot is disclosed in U.S. Pat. No. 5,789,890 to Genov et al. As disclosed therein, such robots typically include end effectors offset from each other so as to be able to obtain a first workpiece from the cassette, spin around, and then acquire a second workpiece. Such robots take up a significant amount of space within the sorter, where space is at a premium owing to the expense of maintaining sorters with ultraclean air. Moreover, typical dual armed robots are expensive, and require complicated controls.
SUMMARY OF THE INVENTION
It is therefore an advantage of the present invention to provide a workpiece handling robot capable of parallel processing of workpieces to improve throughput times.
It is another advantage of the present invention to provide parallel processing of workpieces with relatively minor alteration of a conventional workpiece handling robot.
It is a further advantage of the present invention to provide a versatile workpiece handling robot capable of operating as a dual or single paddle robot.
It is another advantage of the present invention that the aligner does not sit idle while the robot transfers wafers to and from the aligner.
It is a still further advantage of the present invention that the robot does not sit idle while the aligner performs its operations.
These and other advantages are accomplished by the present invention which in preferred embodiments relates to a dual paddle end effector robot capable of parallel processing of workpieces. The robot preferably includes a mast capable of vertical translation into and out of a robot base, a proximal link fixedly mounted to the mast, and a distal link rotatably coupled to the proximal link. The robot further includes an end effector rotatably coupled to the proximal link, which end effector includes a pair of workpiece support paddles capable of rotating with respect to each other.
In particular, the end effector includes a lower paddle rotatably coupled to an end of the distal link, and an upper paddle rotatably coupled to the lower paddle. The lower paddle supports a drive assembly capable of rotating the upper paddle with respect to the lower paddle. The upper and lower paddles are spaced from each other a distance which is preferably equal to the pitch of the workpieces within a cassette with which the robot according to the present invention is operating. Thus, the upper and lower paddles may simultaneously extract a pair of workpieces from shelves within the workpiece cassette.
In one embodiment of the present invention, the dual paddle end effector robot may be used within a wafer sorter to perform parallel processing of workpieces on a pair of aligners within the sorter. In such an embodiment, the robot may first acquire a pair of workpieces from adjacent shelves within the workpiece cassette. After withdrawing from the cassette, the respective paddles on the end effector may fan out and transfer the wafers to the chucks of the respective aligners. After processing of the workpieces on the aligners is complete, the fanned end effector paddles may reacquire the workpieces, the upper paddle may return to its home position located directly over the lower paddle, and then return the processed workpieces to their original cassette or to a new cassette. Parallel processing of workpieces in this fashion provides significantly greater throughput than in conventional wafer sorter systems. Throughput may be improved still further by providing buffering locations for the workpieces at the respective aligners.


REFERENCES:
patent: 4676002 (1987-06-01), Slocum
patent: 5920679 (1999-07-01), Ge et al.
patent: 6155768 (2000-12-01), Bacchi et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System for parallel processing of workpieces does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System for parallel processing of workpieces, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for parallel processing of workpieces will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2590818

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.