System for packaging of electronic circuits

Details System for packaging of electronic circuits System for packaging of electronic circuits

1982-08-30

1984-05-29

Rutledge, L. Dewayne

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

174 52FP, 357 74, H01L 2302

Patent

active

044515405

ABSTRACT:
A brazing technique is described for providing a standard flat pack with a Thermkon base brazed to a Kovar frame through the utilization of an intermediary ring of high thermal conductivity material which prevents flashing onto the Thermkon base. Brazing is accomplished either in a one-step process in which the parts with the intermediary ring are brazed together all at one time with a single heat treatment, or in a two-step process in which the intermediary ring is first brazed to the frame. In a subsequent step, the frame with the intermediary ring brazed thereto, is brazed to the Thermkon base. In either process, the high thermal conductivity of the intermediary ring permits the ring to quickly reach brazing temperature for minimizing flashing.

REFERENCES:
patent: 1996721 (1935-04-01), Gibbs
patent: 3351700 (1967-11-01), Savolainen et al.
patent: 4227036 (1980-10-01), Fitzgerald
patent: 4262300 (1981-04-01), Scherer
patent: 4266089 (1981-05-01), Scherer
patent: 4266090 (1981-05-01), Scherer
Metals Handbook, 8th Ed., vol. 6, p. 605, Aug. 1971.

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