System for mounting electronic device

Details System for mounting electronic device System for mounting electronic device

2005-11-15

2005-11-15

Tugbang, A. Dexter (Department: 3762)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S740000, C029S741000, C029S744000, C029S834000, C029S840000, C228S180220, C228S039000

Reexamination Certificate

active

06964093

ABSTRACT:
An electronics packaging system (1) including a printer (3), a placing unit (4) and a reflow unit (5), wherein a printed wiring board (2) is carried while being kept in an upright position. The printed wiring board (2) has solder printed on all the lands thereof at the same time, the electronic parts (10) are all placed on the lands at the same time, and the electronic parts (10) are all soldered to the lands at the same time. Thus, the system (1) can be designed more compact, and the electronic parts packaged in a shorter time.

REFERENCES:
patent: 4386464 (1983-06-01), Yanai et al.
patent: 5443534 (1995-08-01), Vinciarelli et al.
patent: 5564183 (1996-10-01), Satou et al.
patent: 5659947 (1997-08-01), Eilers et al.
patent: 6295728 (2001-10-01), Shin et al.

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