System for mounting and cooling power semiconductor devices

Details System for mounting and cooling power semiconductor devices System for mounting and cooling power semiconductor devices

1988-12-29

1990-10-23

Hille, Rolf

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 81, 357 82, 361386, 165 802, 16510433, H01L 2342

Patent

active

049656589

ABSTRACT:
Semiconductor apparatus for mounting and cooling disc type semiconductor devices. The apparatus includes two disc type semiconductor devices each having a pole face thereof in contact with a first terminal bar, that bar in turn being in contact, through thermally conductive electrical insulation, with a water-cooled plate. The opposite pole face of each disc device is in electrical and thermal contact with a first surface of a respective metallic block. A second surface of each block, opposing the first face, is in electrical conductive contact with a second terminal bar. A compressive mounting force is applied across the first and second terminal bars to appropriately compress the disc devices. Each metallic block is sized to absorb a substantial portion of the disc device junction heat generated during a transient portion of a duty cycle, such as may correspond to the starting of a motor.

REFERENCES:
patent: 3986201 (1976-10-01), Herold et al.
patent: 4672422 (1987-06-01), Schierz
"High Current Power Semiconductor Modules: How to Cool Them" by Longenecker et al., Power Conversion International, May/Jun. 1985.
"Heat Transfer" by J. P. Holman, 4th ed., pp. 97-102.
Data Sheets for Westinghouse, "Open-Brik Modules".TM., dated Mar. 85.
"Collection of Helpful Hints for: Designing, Using, and Cooling Power Semiconductor Assemblies" by Sheppard et al., IEEE/IAS annual conf., Sep. 28-Oct. 3, 1986.

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