Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-08-14
2007-08-14
Duong, Hung Van (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C711S114000, C165S080300, C312S204000
Reexamination Certificate
active
10930468
ABSTRACT:
A computer system may include one or more modules coupled to a backplane in a housing. A module support structure may allow cooling air to flow upwardly across the modules. In one embodiment, a power section of the module may be located downstream of a data section of the module. In another embodiment, offset brackets may hold a circuit board of a module at an offset relative to a pair of guides in a module support structure. In another embodiment, a heat sink may be coupled between heat producing components on a pair of adjacent modules. In another embodiment, a converter apparatus may support a plurality of modules in a different number of slots in a system. In another embodiment, a heat sink on a module may include a pair of heat pipes arranged such that the heat pipes diverge from one another toward the condenser ends of the heat pipes.
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Olesiewicz Timothy W.
Stewart Thomas E.
Duong Hung Van
Kivlin B. Noäl
Meyertons Hood Kivlin Kowert & Goetzel P.C.
Sun Microsystems Inc.
Thompson Chris D.
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