System for monitoring the topography of a wafer surface...

Radiant energy – Photocells; circuits and apparatus – Photocell controls its own optical systems

Reexamination Certificate

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C356S400000, C355S053000

Reexamination Certificate

active

06979833

ABSTRACT:
A system for monitoring wafer surface topography during a lithographic process is described that includes means for capturing wafer position and surface data at a first time when a wafer is at a first location, means for generating correction data for a second wafer location prior to the wafer reaching the second wafer location, and means for storing the correction data in a spatial delay line. The means for capturing wafer position and surface data includes means for capturing backplane position data with a plurality of stalk gauges. The means for generating correction data includes means for converting the wafer position and surface data from a time-domain into a space domain. The system also includes means for moving the wafer based on the correction data when the wafer is at the second wafer location at a second time.

REFERENCES:
patent: 5825043 (1998-10-01), Suwa
patent: 6057908 (2000-05-01), Ota
patent: 6118515 (2000-09-01), Wakamoto et al.
patent: 6122036 (2000-09-01), Yamasaki et al.
patent: 6608681 (2003-08-01), Tanaka et al.
patent: 6633050 (2003-10-01), Lyons
patent: 0 834 773 (1998-01-01), None
patent: 1 052 683 (2000-11-01), None

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