System for monitoring oxidant concentration of slurry in a...

Details System for monitoring oxidant concentration of slurry in a... System for monitoring oxidant concentration of slurry in a...

2005-02-15

2005-02-15

Nguyen, Tu T. (Department: 2877)

Optics: measuring and testing

For light transmission or absorption

Of fluent material

Reexamination Certificate

active

06856394

ABSTRACT:
A system for monitoring oxidant concentration in a chemical mechanical polishing process, including a spectrometer and a central controller. The spectrometer is coupled to a conduit for supplying slurry between a slurry supply tub and a polishing table. The spectrometer is used to detect the oxidant concentration of the slurry. The central controller is coupled to the spectrometer, the slurry supply tub and the polishing table. The central controller is used to adjust the composition of the slurry in the slurry supply tub and the polishing condition of the polishing table according to the oxidant concentration of the slurry obtained from a signal transmitted by the spectrometer.

REFERENCES:
patent: 6267641 (2001-07-01), Vanell et al.
patent: 6517413 (2003-02-01), Hu et al.

Affiliated with

Also associated with

Rating

System for monitoring oxidant concentration of slurry in a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System for monitoring oxidant concentration of slurry in a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for monitoring oxidant concentration of slurry in a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3464752