System for molding laminated articles of a thermoplastic resin

Details System for molding laminated articles of a thermoplastic resin System for molding laminated articles of a thermoplastic resin

1992-04-10

1994-05-10

Nguyen, Khanh

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

425120, 425561, 425562, 425566, 425DIG228, B29C 4502, B29C 4514, B29C 4518

Patent

active

053103300

ABSTRACT:
A resin article is made between an outer concave mold part and an inner convex mold part that can fit together so that respective surfaces form a substantially closed mold cavity. This is done by first lining the surface of the outer mold part with a liner sheet and then fitting the lined outer mold part to the inner mold part to form the substantially closed mold cavity. A portion of the surface of the inner mold part is positioned to form a pocket open inward into the cavity and this pocket is filled with a mass of fluent synthetic resin. The surface portion is then pressed inward while the parts are fitted together and without otherwise relatively moving the mold parts to force the resin mass from the pocket into the cavity until the inner-part surface portion lies substantially flush with the rest of the inner-part surface.

REFERENCES:
patent: 3278992 (1966-10-01), Strauss
patent: 4071532 (1978-01-01), Rose
patent: 4611983 (1986-09-01), Bielfeldt
patent: 4923539 (1990-05-01), Spengler et al.
patent: 5123833 (1992-06-01), Parker

Affiliated with

Also associated with

Rating

System for molding laminated articles of a thermoplastic resin does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System for molding laminated articles of a thermoplastic resin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for molding laminated articles of a thermoplastic resin will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2410554