Package making – Apparatus for forming or partially forming receptacle and... – Forming a pocket – depression – or hollow compartment by...
Patent
1995-05-31
1997-02-11
Coan, James F.
Package making
Apparatus for forming or partially forming receptacle and...
Forming a pocket, depression, or hollow compartment by...
533745, B65B 4702, B65B 4710
Patent
active
056009399
ABSTRACT:
Apparatus and method for the packaging of an article in a plastic-card package which includes a flat card having a window aperture cut therein fed to the apparatus, and a flat, thermoformable plastic sheet, cut-to-size larger than the aperture and smaller than the face of the card and positioned to cover the aperture. The perimeter of the sheet is heat tacked by an adhesive to the card at a plurality of points around the perimeter of the aperture, and the thermoformable material is heated to form a blister in the sheet and to heat seal the edges of the formed blister to the card. The blister is filled, and the filled blister is covered with a backing cover sheet, and the card sealed to form a package.
REFERENCES:
patent: 3195284 (1965-07-01), Crane, Jr.
patent: 3497059 (1970-02-01), Watts, Jr.
patent: 3657857 (1972-04-01), DeWoskin et al.
patent: 3660962 (1972-05-01), Bliss et al.
patent: 3788032 (1974-01-01), Heffernan et al.
patent: 3920371 (1975-11-01), Faller
patent: 3946537 (1976-03-01), Hair et al.
patent: 5054271 (1991-10-01), DeWoskin
Coan James F.
Crowley Richard P.
Sencorp Systems Inc.
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