System for maintaining uniform copper etching efficiency

Details System for maintaining uniform copper etching efficiency System for maintaining uniform copper etching efficiency

1974-10-24

1976-04-20

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156345, C23F 108

Patent

active

039517110

ABSTRACT:
System and apparatus for the controlled etching of copper work pieces with ferric chloride etchants. The working solution is constantly monitored with regard to its oxidation reduction potential (ORP) by comparison with a standard solution or voltage. To reduce the build up of etched copper in the working solution, an ORP controller activates the removal of specific quantities of that solution which are then replaced in precise stoichiometric proportions with fresh etchant. Simultaneously, oxidant is injected into the fluid to reoxidize ferrous ions to ferric ions. The solution is constantly monitored and the ORP control means repeats the above procedure as often as necessary to maintain the ORP of the fluid within an acceptable range.

REFERENCES:
patent: 3607549 (1971-09-01), Bielefeld et al.
patent: 3775202 (1973-11-01), Meek et al.
patent: 3806393 (1974-04-01), Haas
patent: 3837945 (1974-09-01), Chiang
patent: 3844857 (1974-10-01), Chiang
patent: 3880685 (1975-04-01), Rehm et al.

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