System for improving flip chip performance

Details System for improving flip chip performance System for improving flip chip performance

2009-03-11

2011-10-18

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S778000, C257SE21499

Reexamination Certificate

active

08039957

ABSTRACT:
A system for improving flip chip performance is provided. In one embodiment, the invention relates to an assembly configured to improve performance of a flip chip device, the assembly including a semiconductor die having an active surface and a back surface, the active surface including a plurality of conductive pads, an interposer substrate having a first surface in electrical contact with the active surface of the semiconductor die and a second surface, a space between the active surface of the semiconductor die and the first surface of the interposer substrate, where the space is essentially free of underfill material, and a carrier substrate having a top surface in electrical contact with the second surface of the interposer.

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Gilleo, Ken, http://www.flipchips.com/gilleoUF.html; “Underfill Update: NUF, MUF, WUF, and Other Stuff”, Oct. 22, 2008, 4 pages.
Riley, George A., http://www.flipchips.com/tutorial01.html, “Introduction to Flip Chip: What, Why, How”, Oct. 22, 2008, 6 pages.

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