Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2011-08-02
2011-08-02
Pelham, Joseph M (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C219S601000, C219S649000, C219S653000, C219S655000, C118S724000, C118S729000, C118S7230IR
Reexamination Certificate
active
07989736
ABSTRACT:
Disclosed is a heat treatment system for semiconductor devices. The heat treatment system is used in a heat treatment process for semiconductor devices, such as a crystallization process for an amorphous silicon thin film or a dopant activation process for a poly-crystalline silicon thin film formed on a surface of a glass substrate of a flat display panel including a liquid crystal display (LCD) or an organic light emitting device (OLED). The heat treatment system transfers a semiconductor device after uniformly preheating the semiconductor device in order to prevent deformation of the semiconductor device during the heat treatment process, rapidly performs the heat treatment process under the high temperature condition by heating the semiconductor device using a lamp heater and induction heat derived from induced electromotive force, and unloads the semiconductor device after uniformly cooling the semiconductor device such that the semiconductor device is prevented from being deformed when the heat treatment process has been finished. The heat treatment system rapidly performs the heat treatment process while preventing deformation of the semiconductor device by gradually heating or cooling the semiconductor device.
REFERENCES:
patent: 2188401 (1940-01-01), Crowley
patent: 4263336 (1981-04-01), Thompson et al.
patent: 5356476 (1994-10-01), Foster et al.
patent: 5827773 (1998-10-01), Voutsas
patent: 6747254 (2004-06-01), Kim et al.
patent: 2003/0010775 (2003-01-01), Kim
patent: 2003/0197007 (2003-10-01), Kim et al.
patent: 02-159080 (1990-06-01), None
patent: 05-161961 (1993-06-01), None
patent: 06-315625 (1994-11-01), None
patent: 08-107067 (1996-04-01), None
patent: 2000-082677 (2000-03-01), None
patent: 2000-331986 (2000-11-01), None
patent: 2002-110581 (2002-04-01), None
patent: 2002-198322 (2002-07-01), None
patent: 2002-261040 (2002-09-01), None
patent: 2003-051505 (2003-02-01), None
patent: 2003-092267 (2003-03-01), None
patent: 2003-124206 (2003-04-01), None
patent: 2003-318182 (2003-11-01), None
patent: 10-2000-0033084 (2000-06-01), None
patent: 10-2003-0000294 (2003-01-01), None
patent: 10-2003-0016546 (2003-03-01), None
patent: 10-2003-0083099 (2003-10-01), None
Office Action, Japanese Patent Office, Nov. 16, 2010.
Ahn Young Jae
Kim Hyoung June
Kim Jung Bae
Park Wang Jun
Shin Dong Hoon
Park & Associates IP Law P.C.
Pelham Joseph M
Viatron Technologies Inc.
LandOfFree
System for heat treatment of semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System for heat treatment of semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for heat treatment of semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2733980