System for handling microelectronic dies having a compact...

Details System for handling microelectronic dies having a compact... System for handling microelectronic dies having a compact...

2006-09-05

2006-09-05

Brahan, Thomas J. (Department: 3654)

Material or article handling

Device for emptying portable receptacle

Nongravity type

C029S426600, C156S583200

Reexamination Certificate

active

07101141

ABSTRACT:
According to one aspect of the invention, a system for handling microelectronic dies is provided. Two vertical supports are secured to the frame of the die handler. A wafer support, to support a semiconductor wafer, is mounted between the vertical supports such that the wafer can rotate about its central axis. An ejector arm track is mounted between the vertical supports below the wafer. An ejector arm is mounted to the track for rotation about the central axis of the wafer, and an ejector head is mounted to the ejector arm for translational movement along the ejector arm. A pick arm track is mounted between the vertical supports above the wafer. A pick arm is mounted to the track for rotation about the central axis of the wafer, and a pick head is mounted to the pick arm for translational movement along the pick arm.

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