System for handling microelectronic dies having a...

Details System for handling microelectronic dies having a... System for handling microelectronic dies having a...

2006-01-03

2006-01-03

Arbes, Carl J. (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S739000, C029S741000

Reexamination Certificate

active

06981312

ABSTRACT:
According to one aspect of the invention, a system for handling microelectronic dies is provided. A wafer support, to support a diced semiconductor wafer having microelectronic dies, is mounted to the frame. An ejector head is connected to the frame for movement below the wafer. A pick head is connected to the frame for movement above the wafer. The ejector head has a passageway therethrough and an intake and an outlet. An air pump is connected to the intake to shoot air from the outlet towards one of the dies. The air impinges the wafer support, exerting a force on the die, to assist the pick head in removing the die from the wafer support.

REFERENCES:
patent: 3785507 (1974-01-01), Wiesler et al.
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patent: 4375126 (1983-03-01), Dull et al.
patent: 4494902 (1985-01-01), Kuppens et al.
patent: 4850780 (1989-07-01), Safabakhsh et al.
patent: 4990051 (1991-02-01), Safabakhsh et al.
patent: 6190115 (2001-02-01), Suzuki et al.
patent: 6494667 (2002-12-01), Suzuki et al.

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