System for handling components at a component mounting machine

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se

Reexamination Certificate

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Details

C156S345420, C221S025000, C221S072000, C221S087000, C414S411000, C414S416060

Reexamination Certificate

active

06948541

ABSTRACT:
System for handling components in connection with circuit board assembly in a component mounting machine. The system comprises a number of component tapes provided on component tape reels, and a number of tape guides arranged for receiving component tapes of a given component tape width and for bringing the component tape in position for feeding of the component tape and for picking components from the component tape in the component mounting machine. The tape guides have a similar geometrical outline and basic configuration, and each tape guide comprises a component exposure device for exposing a component at a picking position by removing the portion of the cover tape covering the component. The tape guides are divided into sub-sets of tape guides, wherein the tape guides of each individual sub-set have component exposure devices of the same design, which design is dependent on the configurations of the component tapes intended for that sub-set of tape guides.Each tape guide also comprises visual marking for indicating the sub-set to which the tape guide belongs.

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patent: 5342474 (1994-08-01), Mohara et al.
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patent: 5975395 (1999-11-01), Takada et al.
patent: 6402452 (2002-06-01), Miller et al.
patent: 6619526 (2003-09-01), Souder, Jr.
patent: 6631870 (2003-10-01), Bergstrom
patent: 2002/0014002 (2002-02-01), Bergstrom
patent: 0 496 586 (1992-07-01), None
patent: 0 623 2591 (1994-08-01), None
patent: WO 00/38491 (2000-06-01), None

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