System for generating circuit boards using electroeroded sheet l

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29593, 174 685, 324 73PC, 361414, H05K 336

Patent

active

045877270

ABSTRACT:
By use of an electroerosion technique a plurality of conductive lines (5) are isolated out of an electrically conductive sheet material supported on an isolating substrate of a sheet having holes in a distinct pattern. Several sheets are superimposed in different planes and are alternately mixed with interplane spacer-connector layers between a terminal block (32) and a pressing guide block. The interplane spacer-connector layer (24) contains contact areas interconnected with each other and make contact with isolated zones in different superimposed planes of sheets. The terminal block is provided with sockets for holding the terminals of circuit components of the to-be-developed electrical circuit.

REFERENCES:
patent: 3470612 (1969-10-01), Helms
patent: 3484935 (1969-12-01), Burns
patent: 3583066 (1971-06-01), Carbonel
patent: 4056773 (1977-11-01), Sullivan
patent: 4449769 (1984-05-01), Kobayashi et al.
"Forum on IC Packaging Panels", by Alex Mendelsohn, Electronic Products Magazine, Feb. 1979, pp. 27-36.
"Manufacture of Circuit Boards Utilizing Electroerosion and an Automatic Drafting Table", IBM Technical Disclosure Bulletin, vol. 19, No. 2, Jul. 1976, pp. 575-576.
IBM Tech. Discl. Bull., vol. 8, No. 8, Jan. 1966, p. 1056, by Baffaro.
IBM Tech. Discl. Bull., vol. 8, No. 3, Aug. 1965, p. 434, by Kremen.
IBM Tech. Discl. Bull., vol. 11, No. 8, Jan. 1969, p. 962, by Hermann.
IBM Tech. Discl. Bull., vol. 14, No. 10, Mar. 1972, p. 2869, by Fugardi et al.

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