System for finding the orientation of a wafer

Details System for finding the orientation of a wafer System for finding the orientation of a wafer

1995-07-18

1998-10-20

Kelley, Christopher S.

Image analysis

Applications

Manufacturing or product inspection

382276, 382288, 348 87, G06K 936

Patent

active

058259139

ABSTRACT:
The invention can be used to find the orientation of a semiconductor wafer without wafer handling, i.e., in a non-contact manner. The invention uses knowledge of the position of a semiconductor wafer, and the position of an orientation feature of the wafer, to find the orientation of the wafer. According to the invention, a curved band image is formed that includes an image of an orientation feature. The curved band image is then transformed into a straight band image. The longitudinal position of the orientation feature is then determined in the coordinate system of the straight band image, which longitudinal position is then converted into an angular displacement in the coordinate system of the curved band image to provide the orientation of the wafer.

REFERENCES:
patent: 4803735 (1989-02-01), Nishida et al.
patent: 5048094 (1991-09-01), Aoyama et al.
patent: 5371690 (1994-12-01), Engel et al.
patent: 5381004 (1995-01-01), Uritsky et al.
patent: 5497007 (1996-03-01), Uritsky et al.
patent: 5585917 (1996-12-01), Woite et al.

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