System for fabrication of semiconductor bodies

Details System for fabrication of semiconductor bodies System for fabrication of semiconductor bodies

1977-02-07

1980-02-12

Spicer, Jr., Robert L.

Plastic article or earthenware shaping or treating: apparatus

Means encapsulating normally liquid material

425 6, 264 13, B29C 2300

Patent

active

041881770

ABSTRACT:
A system and method is provided for forming semiconductor tear-drop shaped bodies having minimal grain boundaries. Semiconductor material is melted in a capillary tube at the top of a tower, and forced under gas pressure through a nozzle. Separate semiconductor bodies are formed. They are passed through a free fall path over which a predetermined temperature gradient controls solidification of the bodies. The resultant bodies are tear-drop semiconductor bodies of near uniform size with minimal grain boundaries.

REFERENCES:
patent: 2038251 (1936-04-01), Vogt
patent: 2911672 (1959-11-01), Van Eoven Dorens et al.
patent: 3123855 (1964-03-01), Fischer et al.
patent: 3160686 (1964-12-01), Doyle et al.
patent: 3666850 (1972-05-01), Windecker
patent: 3708560 (1973-01-01), Mayer et al.
patent: 3715418 (1973-02-01), Privott, Jr. et al.
patent: 3753661 (1973-08-01), Simons

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