System for fabrication of semiconductor bodies

Details System for fabrication of semiconductor bodies System for fabrication of semiconductor bodies

1982-03-02

1983-12-27

Hoag, Willard E.

Plastic article or earthenware shaping or treating: apparatus

Means making particulate material directly from liquid or...

264 13, 425DIG13, B29C 2300, B29D 3100

Patent

active

RE0314730

ABSTRACT:
A system and method is provided for forming semiconductor tear-drop shaped bodies having minimal grain boundaries. Semiconductor material is melted in a capillary tube at the top of a tower, and forced under gas pressure through a nozzle. Separate semiconductor bodies are formed. They are passed through a free fall path over which a predetermined temperature gradient controls solidification of the bodies. The resultant bodies are tear-drop semiconductor bodies of near uniform size with minimal grain boundaries.

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patent: 3753661 (1973-08-01), Simons

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