Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-12-06
2010-11-16
Dinh, Tuan T (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S760000, C361S763000
Reexamination Certificate
active
07835157
ABSTRACT:
An interconnect module and a method of manufacturing the same. The method of making an interconnect module on a substrate comprises forming an interconnect section on the substrate. The interconnect section comprises at least two metal interconnect layers separated by a dielectric layer. The method further comprises forming a passive device on the substrate at a location laterally adjacent to the interconnect section. The passive device comprises at least one moveable element comprising a metal layer. The method further comprises forming the metal layer and one of the at least two metal interconnect layers from substantially the same material.
REFERENCES:
patent: 5070317 (1991-12-01), Bhagat
patent: 6147856 (2000-11-01), Karidis
patent: 6909589 (2005-06-01), Huff
Beyne Eric
De Raedt Walter
Jansen Henri
Tilmans Hendrikus
Dinh Tuan T
IMEC
Knobbe Martens Olson & Bear LLP
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