System for electroplating a sequence of moving plate members

Details System for electroplating a sequence of moving plate members System for electroplating a sequence of moving plate members

1975-10-20

1977-01-18

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204199, 204224R, C25D 502, C25D 526

Patent

active

040038050

ABSTRACT:
A continuously operating system is provided to convey a sequence of steel plates in a generally vertical positioning to a plating station where a plurality of power supplied interlinked cathode-plate conveyor members are arranged to carry each plate past a vertically elongated plating head which contains an anode and the electroplating solution. The anode is also vertically elongated, and is adjustably positioned in the plating head or container to be relatively close to the face of the steel plate which is being plated but, at the same time, provides a space for the plating solution to have turbulent flow between the anode and the moving plate. A second plating head may be positioned along side the first to provide for the depositing of a nodular form of copper onto the initial deposit.

REFERENCES:
patent: 900169 (1908-10-01), Hollis
patent: 3468782 (1969-09-01), Bovone
patent: 3723283 (1973-03-01), Johnson et al.

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