Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-04-15
2008-04-15
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S689000, C361S695000, C361S697000, C174S015100, C174S016100, C174S016300, C165S080300, C165S080400, C165S104330
Reexamination Certificate
active
10822958
ABSTRACT:
One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. The hybrid heat transport module and the fansink may be used alone or in combination to dissipate heat from the processor.
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Kim Jeong H.
Stefanoski Zoran
Chervinsky Boris
NVIDIA Corporation
Patterson & Sheridan L.L.P.
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