Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-12-26
2006-12-26
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080300, C165S104330, C361S700000
Reexamination Certificate
active
07154749
ABSTRACT:
One embodiment of a system for efficiently cooling a processor includes a mounting plate configured to be thermally coupled to the processor, a passive heat transport device thermally coupled to the mounting plate and a heat exchanger coupled to the passive heat transport device.
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patent: 2004/0188065 (2004-09-01), Shook et al.
Kim Jeong H.
Stefanoski Zoran
NVIDIA Corporation
Patterson & Sheridan L.L.P.
Thompson Gregory D
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