System for efficiently cooling a processor

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C165S080300, C165S104330, C361S700000

Reexamination Certificate

active

07154749

ABSTRACT:
One embodiment of a system for efficiently cooling a processor includes a mounting plate configured to be thermally coupled to the processor, a passive heat transport device thermally coupled to the mounting plate and a heat exchanger coupled to the passive heat transport device.

REFERENCES:
patent: 6152213 (2000-11-01), Suzuki
patent: 6357515 (2002-03-01), Bhatia
patent: 6450250 (2002-09-01), Guerrero
patent: 6633484 (2003-10-01), Lee et al.
patent: 6830098 (2004-12-01), Todd et al.
patent: 2003/0205363 (2003-11-01), Chu et al.
patent: 2004/0188065 (2004-09-01), Shook et al.

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