System for efficiently cooling a processor

Details System for efficiently cooling a processor System for efficiently cooling a processor

2008-04-15

2008-04-15

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S695000, C361S697000, C174S015100, C174S016100, C174S016300, C165S080300, C165S080400, C165S104330

Reexamination Certificate

active

07359197

ABSTRACT:
One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. The hybrid heat transport module and the fansink may be used alone or in combination to dissipate heat from the processor.

REFERENCES:
patent: 5365749 (1994-11-01), Porter
patent: 6333852 (2001-12-01), Lin
patent: 6343478 (2002-02-01), Chang
patent: 6671177 (2003-12-01), Han
patent: 6717811 (2004-04-01), Lo et al.
patent: 6749012 (2004-06-01), Gwin et al.
patent: 6778394 (2004-08-01), Oikawa et al.
patent: 6970355 (2005-11-01), Ellsworth et al.
patent: 6983789 (2006-01-01), Jenkins et al.
patent: 7142424 (2006-11-01), Malone et al.
patent: 2003/0128514 (2003-07-01), Inoue
patent: 2388637 (2000-07-01), None
patent: 0 542 478 (1993-05-01), None

Affiliated with

Also associated with

Rating

System for efficiently cooling a processor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System for efficiently cooling a processor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for efficiently cooling a processor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2742797