Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-05-09
2006-05-09
Cuneo, Kamand (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S800000, C361S816000, C361S818000, C361S753000, C174S034000, C174S034000, C439S607070
Reexamination Certificate
active
07042737
ABSTRACT:
A system is provided for channeling high frequency signals through sheet metal containment within an electronic device. In exemplary embodiments of the invention, an electronic device employing the system includes a midplane circuit board. One or more interface modules may be coupled to the midplane circuit board, for example, for providing a high frequency interconnect with other devices such as Fiber Channel or the like. A midplane chassis shield is disposed within the device's housing adjacent to the midplane circuit board so that the interface modules interconnect with the midplane circuit board through apertures formed in the shield wherein the midplane circuit board, midplane chassis shield and interface module cooperate for providing a low impedance tunnel for channeling high frequency signals to ground.
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Hobson Norman W.
Woolsey Terrill L.
Cuneo Kamand
Levi Dameon E.
LSI Logic Corporation
Suiter - West - Swantz PC LLO
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