System for drying semiconductor wafers using ultrasonic or low f

Details System for drying semiconductor wafers using ultrasonic or low f System for drying semiconductor wafers using ultrasonic or low f

1999-03-05

2000-09-19

Gravini, Stephen

Drying and gas or vapor contact with solids

Process

Mechanical liquid removal

34179, 34164, F26B 514

Patent

active

061193674

ABSTRACT:
In order to remove water adhering to the surfaces of cleaned semiconductor wafers W, a vibration transmitting device 20 capable of approaching the surfaces of the semiconductor wafers W, and an oscillator 25 for applying an ultrasonic vibration to the vibration transmitting device 20. The oscillator 25 is driven to apply the ultrasonic vibration to the vibration transmitting plates 24 of the vibration transmitting device 20 and to apply energy of the ultrasonic vibration to a gas between the vibration transmitting device 20 and the surfaces of the semiconductor wafer W to remove water adhering the surfaces of the semiconductor wafers W. Thus, it is possible to surely remove water adhering to the surfaces of cleaned objects to be treated, to dry the objects without the need of a dry gas of an organic solvent vapor, such as IPA.

REFERENCES:
patent: 3295492 (1967-01-01), Schink
patent: 3710450 (1973-01-01), Figiel
patent: 5012593 (1991-05-01), Okada et al.
patent: 5105557 (1992-04-01), Vadasz et al.
patent: 5778485 (1998-07-01), Sano et al.

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