System for determining size and location of defects in material

Details System for determining size and location of defects in material System for determining size and location of defects in material

1997-02-12

1999-01-12

Ballato, Josie

Electricity: measuring and testing

Impedance, admittance or other quantities representative of...

Distributive type parameters

324642, 324644, 324534, G01N 2204

Patent

active

058595350

ABSTRACT:
Microwave radiation emitted from a single antenna is focused on a targeted material from which reflected radiation is received by the same antenna to provide signal measurement data from which detected material defects are evaluated by determination of void location and size. Antenna position and orientation is adjusted to obtain the signal measurement data from of the microwave radiation reflection along at least two target incidence paths from the same target location, one of which is normal to said targeted surface of the material and the other oblique thereto at a scattering angle at which the signal radiation intensity is minimized.

REFERENCES:
patent: 3144601 (1964-08-01), Slabodsky
patent: 3233172 (1966-02-01), Luoma
patent: 3549986 (1970-12-01), Prine
patent: 3562642 (1971-02-01), Hochschild
patent: 3810005 (1974-05-01), Bennion et al.
patent: 4097796 (1978-06-01), Lunden
patent: 4255702 (1981-03-01), Tricoles et al.
patent: 4344030 (1982-08-01), Auderson et al.
patent: 4500835 (1985-02-01), Heikila
patent: 4514680 (1985-04-01), Heikkila
patent: 4707652 (1987-11-01), Lowitz
patent: 5068614 (1991-11-01), Fields et al.
patent: 5216372 (1993-06-01), Zoughi et al.
patent: 5363050 (1994-11-01), Guo
patent: 5384543 (1995-01-01), Bible et al.
patent: 5440238 (1995-08-01), Martens
patent: 5497100 (1996-03-01), Reiser
patent: 5502394 (1996-03-01), Piau
Microwave Remote Sensing of An Internal Air-gap or Void in Dielectric Matal by John M. Liu--dated 21 May 1996.

Affiliated with

Also associated with

Rating

System for determining size and location of defects in material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System for determining size and location of defects in material , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for determining size and location of defects in material will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1519916