System for detecting the presence of deposited metals on solderi

Optics: measuring and testing – By polarized light examination – With light attenuation

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356394, 3562371, G01B 1100

Patent

active

060881097

ABSTRACT:
A system for detecting deposited metals on soldering points of an integrated circuit board substrate, a light source, a charge coupled device camera, and a computer. The camera captures an image of the substrate of a ball grid array integrated circuit board and converts the image into a digital image signal. The dot matrix image is transmitted to the computer for analysis by software to examine a conformity index between the image on the substrate to be detected and the image of a reference substrate, thereby providing an automatic detecting function.

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David W. Capson and Sai-Kit Eng, "A Tiered-Color Illumination Approach for Machine Inspection of Solder Joints", IEEE Transactions on Pattern Analysis and Machine Intelligence, vol. 10, No. 3, May 1988, pp388-391, May 1988.

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