System for detecting the endpoint of the polishing of a semicond

Details System for detecting the endpoint of the polishing of a semicond System for detecting the endpoint of the polishing of a semicond

1998-06-04

2000-03-28

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

By optical sensor

451 5, 451 41, 451288, B24B 4900

Patent

active

060424540

ABSTRACT:
A polisher provided with a vibration detection system which can detect vibration caused by rubbing between an article to be polished and a polishing member without any noise which is generated in prior art polishers. The polisher includes a turntable assembly with a polishing surface, a rotatable carrier assembly for holding an article to be polished in such a manner that the article is kept in contact, under pressure with the polishing member while being polished. A vibration detector is provided on the rotatable carrier assembly in order to detect the vibration caused by the rubbing between the article and the polishing member of the turntable assembly. A light signal emission device is provided on the rotatable carrier assembly and is adapted to receive electrical signals transmitted from the vibration detector to generate and emit light signals in response to the vibration detected by the detector. A light signal receiving device is provided on a stationary part of the polisher. The light emission device may be an infrared light emission device.

REFERENCES:
patent: 5667424 (1997-09-01), Pan
patent: 5672091 (1997-09-01), Takahashi et al.
patent: 5762536 (1998-06-01), Pant et al.
patent: 5838447 (1998-11-01), Hiyama et al.
patent: 5872633 (1999-02-01), Holzapfel et al.

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