System for cooling multiple logic molecules

Refrigeration – Structural installation – With electrical component cooling

Reexamination Certificate

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Details

C062S211000, C062S407000, C165S080400, C361S699000

Reexamination Certificate

active

06923014

ABSTRACT:
An exemplary embodiment is a cooling system for cooling multiple logic modules. The cooling system includes a condenser, a first electrically controlled expansion valve coupled to the condenser and a first evaporator coupled to the first electrically controlled expansion valve. A second electrically controlled expansion valve is coupled to the condenser and a second evaporator coupled to the second electrically controlled expansion valve. A controller provides control signals to the first electrically controlled expansion valve and the second electrically controlled expansion valve to control operation of the first electrically controlled expansion valve and the second electrically controlled expansion valve. A compressor is coupled to the first evaporator, the second evaporator and the condenser.

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patent: 0 148 102 (1985-07-01), None
patent: 9-280696 (1997-10-01), None
patent: 11-108228 (1999-04-01), None

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