Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-06-28
2011-06-28
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S700000, C361S709000, C361S715000, C361S716000, C174S015100, C174S015200, C165S080400, C165S104330
Reexamination Certificate
active
07969736
ABSTRACT:
DIMMs are cooled by positioning a thermally conductive base between adjacent DIMMs. The thermally conductive base, such as a heat pipe or metal rod, receives heat from the DIMMs through thermally conductive elements that are selectively biased outward against the installed DIMMs. The base transfers the heat to a liquid conduit extending along the end of the DIMMs, where a circulating liquid carries away the heat. The thermally conductive elements provide an adjustable span to accommodate variations in distance between the DIMM surfaces. Embodiments of the invention may be installed without extending above the height of the DIMM.
REFERENCES:
patent: 4115836 (1978-09-01), Hutchinson et al.
patent: 4186422 (1980-01-01), Laermer
patent: 6025992 (2000-02-01), Dodge et al.
patent: 7023701 (2006-04-01), Stocken et al.
patent: 7106595 (2006-09-01), Foster et al.
patent: 7151668 (2006-12-01), Stathakis
patent: 7286355 (2007-10-01), Cheon
patent: 7342797 (2008-03-01), Kamath et al.
patent: 7405936 (2008-07-01), Campbell et al.
patent: 7755897 (2010-07-01), Chen et al.
patent: 2008/0062652 (2008-03-01), Lieberman et al.
patent: 2008/0251911 (2008-10-01), Farnsworth et al.
patent: 2009/0277616 (2009-11-01), Cipolla et al.
patent: 2010/0025010 (2010-02-01), Cipolla et al.
patent: 2010/0085712 (2010-04-01), Hrehor et al.
patent: 2010/0328891 (2010-12-01), Campbell et al.
Softpedia, “First Water Cooled memory Module”, http: /
ews.softpedia.com
ews/First-Water-Cooled—Cooled—Memory—module—40583.shtml, Jan. 19, 2010, 3 pages.
IPCOM000137893D “Method for low-cost memory cooling”, IP.COM, Jun. 29, 2006, 7 pages.
IPCOM000168297D “DIMM Array Liquid Cooling Structure With FRU-ability Features”, IP.COM, Mar. 5, 2008, 3 pages.
Iyengar Madhusudan K.
Kamath Vinod
Mahaney, Jr. Howard V.
Matteson Jason A.
Steinke Mark E.
Chervinsky Boris L
International Business Machines - Corporation
Seal Cynthia G.
Streets Jeffrey L.
LandOfFree
System for cooling memory modules does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System for cooling memory modules, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for cooling memory modules will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2691026