Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-05-22
2007-05-22
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S697000, C257S721000, C257S722000, C174S016300, C165S080300
Reexamination Certificate
active
10767462
ABSTRACT:
A system is described for cooling a processor. In one embodiment, a heat sink assembly has a fan and air channels. In addition, a heat sink lid that is configured to cover only a region above the fan is coupled to the heat sink assembly.
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Gao Sili
Lowe Walter H.
NVIDIA Corporation
Patterson & Sheridan L.L.P.
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