System for connecting subsystems of dissimilar thermal propertie

Details System for connecting subsystems of dissimilar thermal propertie System for connecting subsystems of dissimilar thermal propertie

1996-12-31

2000-05-23

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361695, 361753, H05K 720

Patent

active

060672323

ABSTRACT:
A system which includes a chassis having a first side and a second side; a circuit board having a set of components, the first circuit board mounted on the first side of the chassis; an integrated circuit package mounted on the second side of the chassis; and a set of electrical connections providing a communications network between the circuit board and the integrated circuit package; wherein the integrated circuit package is thermally coupled to the second side of the chassis.

REFERENCES:
patent: 4825337 (1989-04-01), Karpman
patent: 5272593 (1993-12-01), Jacob
patent: 5327324 (1994-07-01), Roth
patent: 5339214 (1994-08-01), Nelson
patent: 5461540 (1995-10-01), Lee
patent: 5570270 (1996-10-01), Naedel
patent: 5706171 (1998-01-01), Edwards
patent: 5712762 (1998-01-01), Webb

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