System for coating substrates with magnetron cathodes

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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20419212, 20429817, 20429826, C23C 1434

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active

051961059

ABSTRACT:
The present invention provides a system for coating substrates which are arranged within a vacuum chamber on a substrate holder which is situated at least partially in a coating range on whose both sides magnetron cathodes with magnet systems of permanent magnets with outside poles and inside poles are disposed, wherein the polarity of the magnet systems of the magnetron cathodes is such that poles of opposed polarity are opposite one another on both sides of the coating range; and on opposite sides of the coating range at least one magnet coil is disposed, and the oppositely situated magnet coils being connectable to a power source in such a manner that the fields of the magnet coils together make up a closed magnetic field, and that the polarity of the outside poles of the permanent magnet systems and of the magnet coils is the same.

REFERENCES:
patent: 4576700 (1986-03-01), Kadokura et al.
patent: 4871434 (1989-10-01), Munz
patent: 4880515 (1989-11-01), Yoshikawa et al.
patent: 4931158 (1990-06-01), Bunshah et al.
patent: 5000834 (1991-03-01), Yoshikawa
patent: 5022978 (1991-06-01), Hensel et al.
Yeom et al, J. Vac. Sci. & Technol. A 6 Nov./Dec. 1988.
Munz, J. Vac. Sci. & Technol. A 4 (6), Nov. Dec. (1986).

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