System for coating plated through hole surfaces

Details System for coating plated through hole surfaces System for coating plated through hole surfaces

1973-08-06

1977-12-20

Esposito, Michael F.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427256, 427259, 427277, 427355, 427356, 427358, 427372R, 427385R, 427388R, B05D 132, B05D 512

Patent

active

040642909

ABSTRACT:
A system is disclosed for coating the interior surfaces of plated through holes in printed circuit boards by flowing a minimal volume of a low viscosity fluid carrying resist solids through holes in a board. After coating, the liquid phase of the fluid is evaporated, leaving a protective solid coating adhered to the walls of the plated through holes. The system enables positive imaging of the printed circuit boards preparatory to etching.

REFERENCES:
patent: 3268653 (1966-08-01), McNutt
patent: 3340607 (1967-09-01), Shutt
patent: 3776771 (1973-12-01), Shephard
Haddad, Coating of Through Hole Dielectric Substrates, IBM Tech. Discl., vol. 9, No. 3, p. 227 (1966).

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