System for cleaning a wafer

Brushing – scrubbing – and general cleaning – Machines – Brushing

Reexamination Certificate

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C015S088200, C015S102000

Reexamination Certificate

active

07823241

ABSTRACT:
A system for cleaning a wafer. At least one first chuck roller is connected to a first roller base and includes a first annular groove. A second roller base opposes the first roller base. At least one second chuck roller is connected to the second roller base and includes a second annular groove. A sensing chuck roller is connected to the second roller base and includes a third annular groove corresponding to the first and second annular grooves. A cleaning member covers the third annular groove. A circumferential edge of the wafer is positioned in the first and second annular grooves and abuts the cleaning member. The first and second chuck rollers rotate the wafer, enabling the circumferential edge thereof to rub against the cleaning member.

REFERENCES:
patent: 5966765 (1999-10-01), Hamada et al.
patent: 6550091 (2003-04-01), Radman et al.
patent: 6594847 (2003-07-01), Krusell et al.
patent: 6622334 (2003-09-01), Ziemins et al.
patent: 6851152 (2005-02-01), Sotozaki et al.
patent: 2002/0029431 (2002-03-01), Oikawa et al.
patent: WO-2006/116263 (2006-11-01), None

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