System for bonding a heatsink to a semiconductor chip package

Details System for bonding a heatsink to a semiconductor chip package System for bonding a heatsink to a semiconductor chip package

1992-09-29

1994-05-03

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1563071, 1563077, C09J 506

Patent

active

053084292

ABSTRACT:
A method and apparatus for bonding a heatsink to a semiconductor chip package using localized pressure and conducted heat. A thermally conductive adhesive film is positioned between the heatsink and the package. A heated copper slug is positioned on top of the heatsink. Heat conducted from the slug and through the heatsink to the adhesive melts and cures the adhesive under a constant pressure supplied by the dead weight of the slug to create a bond-line having a desired thickness.

REFERENCES:
patent: 4705587 (1987-11-01), Smith
patent: 5106451 (1992-04-01), Kan et al.

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