Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces
Patent
1990-11-20
1992-03-10
Seidel, Richard K.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Plural discrete workpieces
228 9, 228 42, 219 8518, B23K 1125, B23K 3047
Patent
active
050943812
ABSTRACT:
The apparatus of the present invention may be utilized for the automated bonding of electronic components to a circuit board. A placement and bonding head is attached to a manipulatable robotic arm and is utilized to select an electronic component having a plurality of conductive leads from a supply of such components and position that component adjacent a plurality of contact pads on a circuit board. While retaining the electronic component within the placement and bonding head, the component is then thermally bonded to the contact pads. In one embodiment of the present invention, an electronic component may be optically inspected while being retained within the placement and bonding head. In another embodiment, thermal bonding is accomplished utilizing a plurality of thermally activatable blades which each include a thermocouple mounted adjacent thereto. Selective low current control signals are then coupled to the placement and bonding head where transformers are utilized to amplify the current prior to coupling the control signal to individually thermally activatable blades. In yet another embodiment of the present invention, the placement and bonding head includes a plenum for supplying inert gas to the bonding site so that the use of flux is not necessary.
REFERENCES:
patent: 3230338 (1966-01-01), Kawecki
patent: 3790738 (1974-02-01), Laub et al.
patent: 4603802 (1986-08-01), Kurtz et al.
patent: 4715526 (1987-12-01), MacNeil
patent: 4887758 (1989-12-01), Suzuki et al.
IBM Technical Disclosure Bulletin, vol. 31, No. 10, Mar. 1989, pp. 222-228.
Amos Robert A.
Anstrom Joel R.
Bogaczyk Francis W.
Kulterman Robert W.
Nebgen Gilbert B.
Dillon Andrew J.
International Business Machines - Corporation
Knapp Jeffrey T.
Seidel Richard K.
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