System for and method of interconnecting high-frequency...

Details System for and method of interconnecting high-frequency... System for and method of interconnecting high-frequency...

2005-12-27

2005-12-27

Jones, Stephen E. (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Connectors and interconnections

C333S033000, C333S246000

Reexamination Certificate

active

06980068

ABSTRACT:
A cut via is formed in an end of a multilayer circuit board of the first transmission line, and a clearance is provided between the cut via and a ground pattern for achieving an impedance matching between the first and second transmission lines. The cut via of a first transmission line which may be a stripline or a microstrip line, and an electrode of the second transmission line are connected to each other, and ground patterns of the first and second transmission lines are connected to each other. The first and second transmission lines have respective signal lines positioned substantially coaxially with each other.

REFERENCES:
patent: 3201721 (1965-08-01), Voelcker
patent: 5923234 (1999-07-01), Holzman et al.
patent: 6617946 (2003-09-01), Kennedy et al.
patent: 0 347 316 (1989-12-01), None
patent: 1 154 514 (2001-11-01), None
patent: 2001-102817 (2001-04-01), None
NOTE: An English language abstract of the above Japanese citation is provided to serve as a partial translation thereof.
Copending U.S. Appl. No. 10/355,092 filed Jan. 31, 2003 by Yasunori Miyazawa et al.

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