System for achieving desired bondlength of adhesive between a se

Details System for achieving desired bondlength of adhesive between a se System for achieving desired bondlength of adhesive between a se

1991-09-26

1993-04-06

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437902, H01L 2156, H01L 2158

Patent

active

052003655

ABSTRACT:
Spacers are attached to or made an integral part of the housing of a semiconductor package in order to set a desired spacing between a surface of the package housing and the heatsink. Then when the heatsink is attached to the housing, a uniform clearance is maintained between the heatsink and the surface of the housing. When such clearance is filled with an epoxy for bonding the heatsink to the housing, the bondlength of the epoxy layer will be uniform and be of the desired value.

REFERENCES:
patent: 3675089 (1972-07-01), Hantusch et al.
patent: 4899210 (1990-02-01), Lorenzetti et a.
"Metal Wool and Indium Heat Sink"; B. J. Ronkese, IBM T.D.K. vol. 21 No. 3 pp. 1143, 1144, 8-78.

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