System for achieving desired bondlength of adhesive between a se

Details System for achieving desired bondlength of adhesive between a se System for achieving desired bondlength of adhesive between a se

1990-05-14

1991-10-08

James, Andrew J.

357 80, 357 74, 357 72, H01L 2328

Patent

active

050559095

ABSTRACT:
Spacers are attached to or made an integral part of the housing of a semiconductor package in order to set a desired spacing between a surface of the package housing and the heatsink. Then when the heatsink is attached to the housing, a uniform clearance is maintained between the heatsink and the surface of the housing. When such clearance is filled with an epoxy for bonding the heatsink to the housing, the bondlength of the epoxy layer will be uniform and be of the desired value.

REFERENCES:
patent: 3836825 (1974-09-01), Hall et al.
patent: 3846824 (1974-11-01), Bell
patent: 3846825 (1974-11-01), Budd
patent: 3896544 (1975-07-01), Fosnough
patent: 4698662 (1987-10-01), Young et al.
patent: 4733293 (1988-03-01), Gabuzda
patent: 4788627 (1988-11-01), Ehurt et al.
patent: 4899210 (1990-02-01), Lorenzetti et al.

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