Metal fusion bonding – Process – Plural joints
Patent
1997-12-16
2000-05-30
Ryan, Patrick
Metal fusion bonding
Process
Plural joints
228 45, 228 447, 228212, B23K 3102, B23K 3700, B23K 522
Patent
active
060681802
ABSTRACT:
A system (270, 370) for connecting a semiconductor chip (22, 322) to a leadframe (12), the system (270, 370) includes a three-dimensional leadframe (12) and a bonding support mechanism (202, 302, 402). The leadframe (12) may include a first lead (32, 132, 332, 432) having a first base portion (144), a first lead tip (42, 142, 342, 442), and a first longitudinal axis (305); a second lead (30, 130, 330, 430) having a second base portion (140, 321), a second lead tip (36, 136, 336, 436), and a second longitudinal axis. The first lead (32, 132, 332, 432) and second lead (30, 130, 330, 430) formed substantially adjacent to each other, and the second lead (30, 130, 330, 430) having a stepped portion (38, 138, 338, 438) such that the lead tips (42, 142, 342, 442, 36, 136, 336, 436) of the first lead (132, 332, 432) and second lead (130, 330, 430) are separated in a Z-direction (52) and in a Y-direction (52). The bonding support mechanism (202, 302) for holding the three-dimensional leadframe (12) may include a support body (215, 315), a trough (203, 303) formed on the support body (215, 315). The trough (203, 303) may have a first surface (204, 304) at a first elevation, where the first surface (204, 304) is for supporting the second lead tip (36, 136, 336). A second surface (206, 306) may be formed on the support body (215, 315) at a second elevation and substantially adjacent to the first surface (204, 304). The second surface (206, 306) is for supporting the first lead tip (42, 142, 342). The first elevation and second elevation may be displaced from each other. The bonding support mechanism (202, 302) may have an angled surface (210, 310) for accommodating a stepped portion (38, 138, 338, 438) of the second lead (30, 130, 330) and may have additional support surfaces (376, 319).
REFERENCES:
patent: 3995845 (1976-12-01), Scheffer
patent: 4309849 (1982-01-01), Kowalski et al.
patent: 4378902 (1983-04-01), Fedak
patent: 4496965 (1985-01-01), Orcutt et al.
patent: 4582309 (1986-04-01), Moxon et al.
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4891687 (1990-01-01), Mallik et al.
patent: 4987473 (1991-01-01), Johnson
patent: 5054193 (1991-10-01), Ohms et al.
patent: 5107935 (1992-04-01), McBride
patent: 5291059 (1994-03-01), Ishitsuka et al.
patent: 5332463 (1994-07-01), Eberlein et al.
patent: 5530281 (1996-06-01), Groover et al.
patent: 5558267 (1996-09-01), Humphrey et al.
patent: 5639385 (1997-06-01), McCormick
patent: 5647528 (1997-07-01), Ball et al.
patent: 5676301 (1997-10-01), Hernandez et al.
Hoel Carlton H.
Ryan Patrick
Stoner Kiley
Telecky Jr. Frederick J.
Texas Instruments Incorporated
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