System and process for heating semiconductor wafers by...

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

Reexamination Certificate

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C219S390000, C219S405000, C219S411000, C219S121600, C219S121740, C219S121820, C219S121660, C118S724000, C118S725000, C118S050000, C392S416000, C392S418000

Reexamination Certificate

active

07015422

ABSTRACT:
Various processes for heating semiconductor wafers is disclosed. In particular, the present invention is directed to configuring light sources emitting light energy onto a wafer in order to optimize absorption of the energy by the wafer. Optimization is carried out by varying the angle of incidence of the light energy contacting the wafer, using multiple wavelengths of light, and configuring the light energy such that it contacts the wafer in a particular polarized state. In one embodiment, the light energy can be emitted by a laser that is scanned over the surface of the wafer.

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